Electronic Components & Materials Expo 2027
From
February 17, 2027
until
February 19, 2027
(Please double-check the dates and location on the organizer below before attending.)
Categories: Electronics Industry
ELECTRONIC COMPONENTS MATERIALS EXPO
As a key part of NEPCON JAPAN, this leading exhibition focuses on the latest advancements in electronic components and materials. The event serves as a vital platform for industry professionals to discover innovative solutions and network with key suppliers.
Main Exhibit Categories
- Electronic Components: Condensers, capacitors, connectors, sensors, switches, and semiconductors.
- Electronic Materials: Circuit board materials, semiconductor packaging materials, adhesives, and advanced films.
Target Visitor Profile
The expo attracts manufacturers across various high-tech industries, including:
- Electric/Electronic Devices
- Medical Devices
- Aircraft/Aerospace Devices
- Automobiles and Automotive Components
- Semiconductor Assembly
- LED Technology
Organized by RX Japan, the expo runs concurrently with other major trade shows like INTERNEPCON JAPAN, IC SENSOR PACKAGING EXPO, and PWB EXPO, offering a comprehensive overview of the electronics manufacturing supply chain.
Register for entry or booths
Please register at the organizer website of Electronic Components & Materials Expo
Venue Map and Hotels Around
Koto - Tokyo Big Sight, Tokyo, Japan