NEPCON JAPAN - R&D and Manufacturing 2027

Name: NEPCON JAPAN - R&D and Manufacturing
Start: 2027-02-17
End: 2027-02-19
Location: Koto - Tokyo Big Sight, Tokyo, Japan

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From February 17, 2027 until February 19, 2027

At Koto - Tokyo Big Sight, Tokyo, Japan ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.nepconjapan.jp/tokyo/en-gb.html

Categories: Electronics Industry

Tags: Manufacturing, Packaging, Electronics, Tokyo, exhibition, technology

NEPCON JAPAN is Asia’s premier exhibition for electronics R&D, manufacturing and packaging technology, held Feb 17‑19, 2027 at Tokyo Big Sight. The show expects about 1,800 exhibitors and 88,000 visitors. It aggregates eight specialised expos: Power Device & Module Expo, IC & Sensor Packaging Expo, PWB (Printed Wiring Board) Expo, Electronic Components & Materials Expo, Fine Process Technology Expo, EMS & ODM Expo, plus related technical conferences curated by industry experts. Exhibitors showcase power devices, modules, integrated circuits, sensors, advanced packaging, PCBs, electronic components, raw materials, precision process equipment, and contract manufacturing services. The event serves as a one‑stop venue for professionals across the electronics supply chain, offering product demonstrations, networking, and conference sessions on emerging technologies.

Register for entry or booths

Please register at the organizer website of NEPCON JAPAN - R&D and Manufacturing

https://www.nepconjapan.jp/tokyo/en-gb.html

Venue Map and Hotels Around

Koto - Tokyo Big Sight, Tokyo, Japan