Canton Fair net

IC & SENSOR PACKAGING TECHNOLOGY EXPO 2027

Registration
Request Booths
Accommodation
Comments
Suggest an edit
IC & SENSOR PACKAGING TECHNOLOGY EXPO Koto 2027
From February 17, 2027 until February 19, 2027
At Koto - Tokyo Big Sight, Tokyo, Japan ( Show Map)
[email protected]
(Please double-check the dates and location on the organizer below before attending.)
 https://www.nepconjapan.jp/en-gb/about/exhibits/ic-sensor-packaging-technology-expo.html
Categories: Electronics Industry, Technology Sector
Tags: IC, Manufacturing, Packaging, Semiconductors, Electronics, Materials, Equipment, sensors, exhibition, technology

IC Sensor Packaging Technology EXPO

Asia’s leading exhibition for IC final manufacturing, gathering advanced equipment, materials, and services. The event is held across multiple editions in Tokyo, Osaka, and Nagoya, featuring a Technical Conference organized by industry-leading experts.

Main Exhibits and Categories

  • IC Sensor Packaging
  • InterNEPCON Japan
  • Electrotest Japan
  • Electronic Components and Materials
  • Printed Wiring Board (PWB)
  • Fine Process Technology
  • Power Devices and Modules
  • EMS and ODM

Register for entry or booths

Please register at the organizer website of IC & SENSOR PACKAGING TECHNOLOGY EXPO

Venue Map and Hotels Around

Koto - Tokyo Big Sight, Tokyo, Japan