Electronic Components and Materials Expo 2027
From
February 17, 2027
until
February 19, 2027
+81-3-3349-8502
(Please double-check the dates and location on the organizer below before attending.)
Categories: Electronics Industry
ELECTRONIC COMPONENTS MATERIALS EXPO
As part of NEPCON JAPAN, this leading exhibition focuses on the latest advancements in electronic components and materials. The event caters to manufacturers across various industries, including automotive, aerospace, medical devices, and semiconductor assembly.
Main Exhibit Categories
- Electronic Components: Condensers, capacitors, connectors, sensors, switches, and semiconductors.
- Electronic Materials: Circuit board materials, semiconductor packaging materials, adhesives, and advanced films.
Target Visitors
Professionals from electric/electronic device manufacturing, medical devices, aircraft/aerospace, automobile, semiconductor assembly, automotive components, and LED industries.
Concurrent Shows
| INTERNEPCON JAPAN | ELECTROTEST JAPAN |
| IC SENSOR PACKAGING EXPO | PWB EXPO |
| FINE PROCESS TECHNOLOGY EXPO | Power Device and Module Expo |
| EMS & ODM EXPO |
Register for entry or booths
Please register at the organizer website of Electronic Components and Materials Expo
Venue Map and Hotels Around
Koto - Tokyo Big Sight, Tokyo, Japan