Power Device & Module Expo 2027

Name: Power Device & Module Expo
Start: 2027-02-17
End: 2027-02-19
Location: Koto - Tokyo Big Sight, Tokyo, Japan

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From February 17, 2027 until February 19, 2027

At Koto - Tokyo Big Sight, Tokyo, Japan ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.nepconjapan.jp/tokyo/en-gb/visit/access.html

Categories: Electronics Industry

Tags: Travel, Manufacturing, Electronics, Semiconductor, Japan, Tokyo, NEPCON, technology, expo

The Tokyo Show, held at Tokyo Big Sight, Japan from February 17 to 19, 2027, showcases a broad spectrum of electronic and manufacturing technologies. Core exhibition zones include INTERNEPCON JAPAN, ELECTROTEST JAPAN, IC SENSOR PACKAGING EXPO, ELECTRONIC COMPONENTS MATERIALS EXPO, PWB EXPO, FINE PROCESS TECHNOLOGY EXPO, Power Device and Module Expo, and EMS＆ODM EXPO. These categories cover everything from semiconductor testing and sensor integration to printed wiring board production, advanced packaging, power modules, and contract manufacturing services. The event provides a platform for industry professionals to explore the latest innovations, network with suppliers, and attend technical sessions, supporting the growth of Japan’s electronics and manufacturing sectors.

Power Device & Module Expo 2027

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