Power Device and Module Expo 2027
From
February 17, 2027
until
February 19, 2027
(Please double-check the dates and location on the organizer below before attending.)
Categories: Electronics Industry
The NEPCON Japan Tokyo Show, held at Tokyo Big Sight from February 17 to 19, 2027, brings together a series of specialized expos covering the full spectrum of electronic manufacturing. Key categories include InterNEPCON Japan, Electrotest Japan, IC Sensor Packaging Expo, Electronic Components & Materials Expo, PWB (Printed Wiring Board) Expo, Fine Process Technology Expo, Power Device and Module Expo, and EMS & ODM Expo. The event showcases the latest technologies, products, and services for the semiconductor, packaging, component, and manufacturing sectors, attracting industry professionals, suppliers, and innovators from around the world.
Register for entry or booths
Please register at the organizer website of Power Device and Module Expo
Venue Map and Hotels Around
Koto - Tokyo Big Sight, Tokyo, Japan