Electronics Manufacturing and Packaging Exhibition 2027

Name: Electronics Manufacturing and Packaging Exhibition
Start: 2027-02-17
End: 2027-02-19
Location: Koto - Tokyo Big Sight, Tokyo, Japan

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From February 17, 2027 until February 19, 2027

At Koto - Tokyo Big Sight, Tokyo, Japan ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.nepconjapan.jp/tokyo/en-gb.html

Categories: Electronics Industry, Packaging Industry

Tags: Elecronics, Manufacturing, Packaging, Electronics, Semiconductor, R&D, conference, exhibition

NEPCON JAPAN is Asia’s leading electronics R&D, manufacturing and packaging exhibition, scheduled for 17‑19 February 2027 at Tokyo Big Sight. The event will host about 1,800 exhibitors and attract roughly 88,000 visitors. It comprises eight specialized shows, including the Power Device & Module Expo, IC Sensor Packaging Expo, PWB Expo, Fine Process Technology Expo, Electronic Components & Materials Expo, EMS & ODM Expo, Electrotest Japan, and InterNEPCON Japan. These categories cover power devices, semiconductor testing, sensor and packaging technologies, printed‑wire‑board production, advanced process equipment, component materials, and contract manufacturing services, providing a one‑stop venue for the entire electronics supply chain. The exhibition also features a technical conference program planned by industry experts.

Register for entry or booths

Please register at the organizer website of Electronics Manufacturing and Packaging Exhibition

https://www.nepconjapan.jp/tokyo/en-gb.html

Venue Map and Hotels Around

Koto - Tokyo Big Sight, Tokyo, Japan