Advanced Packaging and Chiplet Summit (APCS) 2026

Name: Advanced Packaging and Chiplet Summit (APCS)
Start: 2026-12-09
End: 2026-12-11
Location: Tokyo - Tokyo Big Sight, Tokyo, Japan

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From December 09, 2026 until December 11, 2026

At Tokyo - Tokyo Big Sight, Tokyo, Japan ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.semiconjapan.org/en/apcs

Categories: Packaging Industry, Electronics and ICT

Tags: Design, Packaging, Semiconductor, networking

Advanced Packaging and Chiplet Summit 2026

APCS serves as a platform to accelerate the growth of Japan's advanced packaging and chiplet ecosystem, offering insights and networking across the electronics manufacturing supply chain.

Dates: December 9-11, 2026
Location: Tokyo Big Sight (East Halls 4-6), Tokyo, Japan
Concurrent events: SEMICON Japan 2026, ADIS, Metrology & Inspection Summit
Organizer: SEMI

Register for entry or booths

Please register at the organizer website of Advanced Packaging and Chiplet Summit (APCS)

https://www.semiconjapan.org/en/apcs

Venue Map and Hotels Around

Tokyo - Tokyo Big Sight, Tokyo, Japan