IC & Sensor Packaging Technology EXPO 2027
From
February 17, 2027
until
February 19, 2027
(Please double-check the dates and location on the organizer below before attending.)
IC Sensor Packaging Technology Expo (ISP)
Recognized as Asia’s leading exhibition for IC final manufacturing, the IC Sensor Packaging Expo gathers advanced equipment, materials, and services essential to the industry. The event is a key part of the NEPCON JAPAN series, featuring a technical conference planned by industry-leading experts.
The expo focuses on the latest innovations and technologies in IC and sensor packaging. Key exhibits and categories include:
- IC final manufacturing equipment
- Advanced sensor packaging technologies
- Materials and services for IC manufacturing
ISP is co-located with several major industry events, providing a comprehensive overview of the electronics manufacturing supply chain:
| Co-located Shows |
|---|
| INTERNEPCON JAPAN |
| ELECTROTEST JAPAN |
| ELECTRONIC COMPONENTS MATERIALS EXPO |
| PWB EXPO |
| FINE PROCESS TECHNOLOGY EXPO |
| Power Device and Module Expo |
| EMS & ODM EXPO |
Register for entry or booths
Please register at the organizer website of IC & Sensor Packaging Technology EXPO
Venue Map and Hotels Around
Tokyo - Tokyo Big Sight, Tokyo, Japan