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IC & Sensor Packaging Technology EXPO 2027

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IC & Sensor Packaging Technology EXPO Tokyo 2027
From February 17, 2027 until February 19, 2027
At Tokyo - Tokyo Big Sight, Tokyo, Japan ( Show Map)
(Please double-check the dates and location on the organizer below before attending.)
 https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html
Categories: Electronics Industry, Packaging Industry, Miscellaneous
Tags: IC, Manufacturing, Packaging, Electronics, Materials, Semiconductor, Equipment, sensors, exhibition, technology

IC Sensor Packaging Technology Expo (ISP)

ISP is Asia’s leading exhibition for IC final manufacturing, bringing together advanced equipment, materials, and services. The event is part of NEPCON JAPAN and runs concurrently with several other major trade shows, creating a comprehensive platform for the electronics manufacturing industry.

Co-located Exhibitions

  • INTERNEPCON JAPAN
  • ELECTROTEST JAPAN
  • ELECTRONIC COMPONENTS MATERIALS EXPO
  • PWB EXPO
  • FINE PROCESS TECHNOLOGY EXPO
  • Power Device and Module Expo
  • EMS & ODM EXPO

Event Editions

The expo is held across multiple locations throughout the year:

EditionDatesVenue
OsakaMay 13-15, 2026INTEX Osaka
Tokyo (Sep)Sep 9-11, 2026Makuhari Messe
NagoyaNov 25-27, 2026Aichi Sky Expo
Tokyo (Feb)Feb 17-19, 2027Tokyo Big Sight

The event is organized by RX Japan GK and features a Technical Conference planned by industry-leading experts.

Register for entry or booths

Please register at the organizer website of IC & Sensor Packaging Technology EXPO

Venue Map and Hotels Around

Tokyo - Tokyo Big Sight, Tokyo, Japan