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IC & Sensor Packaging Expo 2027

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IC & Sensor Packaging Expo Koto 2027
From February 17, 2027 until February 19, 2027
At Koto - Tokyo Big Sight, Tokyo, Japan ( Show Map)
(Please double-check the dates and location on the organizer below before attending.)
 https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html
Categories: Packaging Industry
Tags: IC, Manufacturing, Packaging, Electronics, Materials, Semiconductor, Equipment, sensors, exhibition, technology

IC Sensor Packaging Technology Expo (ISP)

ISP is Asia’s leading exhibition for IC final manufacturing, bringing together advanced equipment, materials, and services. The event is part of the larger NEPCON JAPAN exhibition series, which hosts multiple editions throughout the year.

Main Exhibits and Categories

  • IC Sensor Packaging Equipment and Materials
  • Advanced IC Final Manufacturing Technologies

Co-located Shows (Varies by Edition)

  • INTERNEPCON JAPAN
  • ELECTROTEST JAPAN
  • ELECTRONIC COMPONENTS MATERIALS EXPO
  • PWB EXPO
  • FINE PROCESS TECHNOLOGY EXPO
  • Power Device and Module Expo
  • EMS & ODM EXPO

Event Schedule

EditionDatesVenue
MayMay 13-15, 2026INTEX Osaka
SeptemberSep 9-11, 2026Makuhari Messe
NovemberNov 25-27, 2026Aichi Sky Expo
FebruaryFeb 17-19, 2027Tokyo Big Sight

Register for entry or booths

Please register at the organizer website of IC & Sensor Packaging Expo

Venue Map and Hotels Around

Koto - Tokyo Big Sight, Tokyo, Japan