Power Device & Module Expo 2027
From
February 17, 2027
until
February 19, 2027
(Please double-check the dates and location on the organizer below before attending.)
Categories: Electronics Industry
Power Device and Module Expo
The Power Device and Module Expo is a specialized exhibition showcasing a comprehensive range of power devices, module components, materials, and manufacturing and testing equipment. Launched in January 2024, the event provides a platform to discover the latest innovations and advancements in the industry.
Main Exhibits & Categories
- Power devices and module components
- Materials for power modules
- Manufacturing equipment
- Testing equipment
Key Industry Sectors
The expo primarily focuses on the following sectors:
- Automotive
- Energy
- Railroad
- Industrial equipment
Co-located Events
Held within NEPCON JAPAN, Asia's leading exhibition for electronics R&D, manufacturing, and packaging technology, the expo runs alongside several other specialized shows, including:
- INTERNEPCON JAPAN
- ELECTROTEST JAPAN
- IC SENSOR PACKAGING EXPO
- ELECTRONIC COMPONENTS MATERIALS EXPO
- PWB EXPO
- FINE PROCESS TECHNOLOGY EXPO
- EMS & ODM EXPO
Register for entry or booths
Please register at the organizer website of Power Device & Module Expo
Venue Map and Hotels Around
Koto - Tokyo Big Sight, Tokyo, Japan