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InterPACK 2026 Conference & Exhibition 2026

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InterPACK 2026 Conference & Exhibition San Diego 2026
From October 26, 2026 until October 29, 2026
At San Diego - San Diego Marriott Mission Valley, California, United States ( Show Map)
(Please double-check the dates and location on the organizer below before attending.)
 https://event.asme.org/InterPACK
Categories: Packaging Industry, Electronics and ICT, Science and Research, Technology
Tags: Packaging, Electronics, IoT, Research, Photonics, Simulation, conference, integration

InterPACK 2026

The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems

InterPACK is the leading global forum for research, development, manufacturing, and applications in electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).

Dates & Venue

  • Dates: October 26–29, 2026
  • Venue: San Diego Marriott Mission Valley, 8757 Rio San Diego Drive, San Diego, CA 92108, USA
  • Format: In-person

Focus Areas

Heterogeneous Integration; Data Center and Modular Edge Systems; Electronic Packaging for Extreme Environments; Power/RF Electronics and Photonics; Nanoscale Heat Transfer and Energy Storage; Flexible, Wearable, and Printed Electronics; Intelligent Modeling and Simulation; Micro/Nano Mechatronics and IoT applications.

Program

Technical paper presentations, exhibits, panel discussions, workshops, tutorials, keynotes, technology talks, and a joint poster session uniting industry, national labs, and academia.

Official Site

event.asme.org/InterPACK

Note: This is ASME InterPACK (electronics/photonic packaging), not Messe Düsseldorf Interpack.

Register for entry or booths

Please register at the organizer website of InterPACK 2026 Conference & Exhibition

Venue Map and Hotels Around

San Diego - San Diego Marriott Mission Valley, California, United States