InterPACK 2026 Conference & Exhibition 2026
From
October 26, 2026
until
October 29, 2026
(Please double-check the dates and location on the organizer below before attending.)
Categories: Electronics Industry, Electronics and ICT
InterPACK 2026 is the leading global forum for research, development, manufacturing and applications in electronics packaging and heterogeneous integration, organized by the ASME Electronic and Photonic Packaging Division. The 2026 edition is held in person October 26-29, 2026 at the San Diego Marriott Mission Valley, California, featuring technical paper presentations, exhibits, panels, workshops and tutorials spanning advanced materials, thermal management, photonics, power electronics and more.
Register for entry or booths
Please register at the organizer website of InterPACK 2026 Conference & Exhibition
Venue Map and Hotels Around
San Diego - San Diego Marriott Mission Valley, California, United States