Power Device & Module Expo - NEPCON JAPAN 2027 2027

Name: Power Device & Module Expo - NEPCON JAPAN 2027
Start: 2027-02-17
End: 2027-02-19
Location: Tokyo - Tokyo Big Sight, Tokyo, Japan

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From February 17, 2027 until February 19, 2027

At Tokyo - Tokyo Big Sight, Tokyo, Japan ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.nepconjapan.jp/tokyo/en-gb.html

Categories: Electronics Industry, Electronics and ICT, Industrial Manufacturing, Technology

Tags: Travel, Manufacturing, Electronics, Semiconductor, Japan, Tokyo, NEPCON, technology, expo

Power Device & Module Expo is one of the eight specialised shows comprising NEPCON JAPAN 2027 (the 41st edition), Asia's leading exhibition for electronics R&D, manufacturing and packaging technology. It is held 17-19 February 2027 at Tokyo Big Sight, Tokyo, Japan, organised by RX Japan. The expo focuses on power electronics: SiC/GaN semiconductors, power modules, thermal management, control/drive/sensing and related materials and manufacturing equipment. Concurrent shows include INTERNEPCON JAPAN, ELECTROTEST JAPAN and IC & Sensor Packaging Expo.

Register for entry or booths

Please register at the organizer website of Power Device & Module Expo - NEPCON JAPAN 2027

https://www.nepconjapan.jp/tokyo/en-gb.html

Venue Map and Hotels Around

Tokyo - Tokyo Big Sight, Tokyo, Japan