Electronic Packaging, Electro-Mechanical Solutions & 3D Day 2026

Name: Electronic Packaging, Electro-Mechanical Solutions & 3D Day
Start: 2026-10-13
End: 2026-10-13
Location: Tel Aviv-Yafo - Tel Aviv Convention Center, Tel Aviv District, Israel

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From October 13, 2026 until October 13, 2026

At Tel Aviv-Yafo - Tel Aviv Convention Center, Tel Aviv District, Israel ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.new-techevents.com/electronic-packaging-and-electro-mechanical-solutions/

Categories: Electronics Industry, Packaging Industry

Tags: Elecronics, Manufacturing, Cables, Packaging, Electronics, Mechanical, conference, 3d

The Electronic Packaging, Electro‑Mechanical Solutions 3D Day is a one‑day (08:30‑15:30) exhibition and conference in Tel‑Aviv (Pavilion 10) aimed at engineers, project managers, manufacturing and procurement professionals. It showcases the latest in electronic packaging interconnect technologies, eco‑friendly server racks, military and commercial automotive packaging, thermal‑management cooling solutions, industrial design, simulation, environmental testing, metal‑plastic machining and fastener standardisation. Expert‑led sessions cover smart packaging materials and coatings, rapid‑prototype 3D printing, EMC/EMI/RFI compliance and custom packaging for extreme conditions. The event offers free admission with prior registration, providing networking and business opportunities with leading manufacturers and solution providers.

Register for entry or booths

Please register at the organizer website of Electronic Packaging, Electro-Mechanical Solutions & 3D Day

https://www.new-techevents.com/electronic-packaging-and-electro-mechanical-solutions/

Venue Map and Hotels Around

Tel Aviv-Yafo - Tel Aviv Convention Center, Tel Aviv District, Israel