Electronic Packaging, Electro-Mechanical Solutions & 3D Day 2026
Electronic Packaging, Electro-Mechanical Solutions & 3D Day
The annual Electronic Packaging, Electro-Mechanical Solutions & 3D Printing Conference and Exhibition takes place on 13 October 2026 at Expo Tel Aviv, Pavilion 10, alongside the Military & Aviation Exhibition. Organiser: New-Tech Magazines Group (New-Tech Events).
Hours: 08:30–15:30. Admission is free; prior registration is required.
Who it is for
The event is designed for industry professionals — engineers, project managers, manufacturing and engineering experts, and procurement specialists — including R&D, mechanical, electronics, design, manufacturing, quality and reliability engineers, engineering managers and purchasing professionals in defence and aerospace, medical devices, and electronic/electro-mechanical systems.
Topics
The exhibition and conference cover electronic packaging and interconnect technologies; eco-friendly and advanced server racks; military, commercial and automotive packaging; thermal management and cooling; industrial design, simulation and environmental testing; metal and plastic machining, fasteners and standardisation; smart packaging materials and coatings; 3D printing and rapid prototyping; EMC/EMI/RFI compliance; and customised packaging for extreme conditions.
Official site
Electronic Packaging, Electro-Mechanical Solutions & 3D Day
Register for entry or booths
Venue Map and Hotels Around
Tel Aviv - Expo Tel-Aviv, Pavilion 10, Tel Aviv District, Israel