Adhesion & Bonding Expo 2027
Adhesion & Bonding Expo is RX Japan's specialised industrial adhesion and bonding exhibition, held inside Highly-functional Material Week.
The next Osaka edition runs 12–14 May 2027, 10:00–17:00, at INTEX Osaka (1-5-102 Nanko-kita, Suminoe-ku). Organiser: RX Japan GK.
The show gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, and diffusion, including dissimilar-material joining. It is co-located with Highly-functional Material Week specialised fairs for film, plastics, metal, ceramics, paint and coating, and sustainable materials, plus Photonix.
Osaka visitor registration is scheduled to open around March 2027. Visitor enquiry: [email protected] / +81-3-6739-4118. Exhibitor enquiry (English): [email protected].