Adhesion & Bonding Expo 2027
Adhesion & Bonding Expo (Osaka) is RX Japan's industrial adhesion and bonding show, held inside Highly-functional Material Week.
Next Osaka edition: 12–14 May 2027, 10:00–17:00, at INTEX Osaka, Japan.
The show gathers joining equipment and bonding technologies from materials through welding, friction stirring, ultrasonic bonding and diffusion, with a focus on dissimilar-material joining used in automobiles, electronics and construction. It runs alongside other Highly-functional Material Week specialised fairs for advanced films, plastics, metal, ceramics, paint and coating, and sustainable materials.
RX Japan also lists concurrent Adhesion & Bonding Expo editions at Port Messe Nagoya (17–19 February 2027) and Makuhari Messe (27–29 October 2027); this record is the Osaka show only.
Organiser: RX Japan GK. Exhibitor enquiries: [email protected] / +81-3-6739-4118.