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Internepcon Japan 2027

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Internepcon Japan Koto 2027
From February 17, 2027 until February 19, 2027
At Koto - Tokyo Big Sight, Tokyo, Japan ( Show Map)
(Please double-check the dates and location on the organizer below before attending.)
 https://www.nepconjapan.jp/tokyo/en-gb.html
Categories: Technology Sector
Tags: Manufacturing, Packaging, Electronics, Research, R&D, Devices, sensors, exhibition, components, technology, modules

NEPCON JAPAN

Asia's leading exhibition for electronics R&D, manufacturing, and packaging technology. Launched over 40 years ago, it serves as a one-stop venue for the Asian electronics industry. The 2027 edition expects around 1,800 exhibitors and 88,000 visitors.

8 Specialised Shows

  • INTERNEPCON JAPAN
  • ELECTROTEST JAPAN
  • IC SENSOR PACKAGING EXPO
  • ELECTRONIC COMPONENTS MATERIALS EXPO
  • PWB EXPO
  • FINE PROCESS TECHNOLOGY EXPO
  • Power Device and Module Expo
  • EMS & ODM EXPO

Register for entry or booths

Please register at the organizer website of Internepcon Japan

Venue Map and Hotels Around

Koto - Tokyo Big Sight, Tokyo, Japan