INTER PACK EXPO Shanghai International Packaging Exhibition 2027

PACK FAIR 2027 Shanghai International Packaging Exhibition

PACK FAIR 2027 is the 18th edition of a major packaging industry event, organized by Shanghai Hexin Exhibition Service Co., Ltd. It covers the entire packaging industry chain with 650+ exhibitor brands and 60,000+ professional visitors expected.

Four Themed Exhibition Zones

• PRINT TECH – International printing technology exhibition, one of China's most influential printing industry events, now in its 19th edition.
• LABEL EXPO – Focused on label printing and processing, covering the full label, packaging, and printing industry chain across the Asia-Pacific region.
• CIPPME – Packaging products and materials exhibition, serving as a major trade platform with reach across Asia and emerging markets in Southeast Asia, South America, the Middle East, and North Africa.
• INTPAK – Intelligent packaging industry exhibition, showcasing packaging technology and machinery with a focus on smart and automated solutions.

Key Exhibits & Focus Areas

• Packaging products, materials, and related machinery/equipment
• Smart packaging and intelligent packaging industrial technologies
• Eco-friendly and green packaging solutions
• Innovative packaging designs and structures
• Printing inks, screen printing equipment, thermal transfer ribbons
• Logistics and express delivery packaging
• EPE foam and other packaging materials

Exhibitor Highlights

Featured companies include Haoneng (packaging), Gangyi Screen Printing, Nanjing Aibao (thermal transfer ribbons), Hebei Fangda (logistics packaging), Zhejiang GCL (EPE foam), Dehui Precision Machinery, Ruiqi'er, and Suzhou Kede Education (offset printing inks).

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Register for entry or booths

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Venue Map and Hotels Around

Shanghai - Shanghai World Expo Exhibition and Convention Center, Shanghai, China