Shenzhen Semiconductor Packaging Technology Fair 2026

Name: Shenzhen Semiconductor Packaging Technology Fair
Start: 2026-10-27
End: 2026-10-29
Location: Shenzhen - Shenzhen World Exhibition & Convention Center, Guangdong, China

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From October 27, 2026 until October 29, 2026

At Shenzhen - Shenzhen World Exhibition & Convention Center, Guangdong, China ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.nepconasia.com/en-gb.html

Categories: Technology Sector

Tags: Automation, Manufacturing, Electronics, Robotics, Semiconductor

NEPCON ASIA 2026, held 27‑29 October at Shenzhen World Exhibition Convention Center, is a comprehensive platform for electronic manufacturing. The show spans the full electronics value chain, featuring six concurrent trade shows that draw over 60,000 buyers. Core exhibit categories include semiconductor packaging and testing, PCB assembly (materials, dispensing, placement, conformal coating), smart‑factory automation, touch‑display technology, automotive electronics, industrial control, new energy, and humanoid robotics. Key concurrent events are the IC Packaging Fair, Smart Factory Automation Technology Expo, VisionChina (machine vision), Robotech Asia, and the Embedded Robotics Technology Application Expo. Over 600 global suppliers showcase 150+ new products and processes, while 200+ experts present in 40+ forums, workshops and competitions covering AI integration, low‑altitude logistics, and low‑volume customization. The exhibition also offers extensive networking through the TAP program, business matchmaking, and country‑day series for overseas visitors.

Register for entry or booths

Please register at the organizer website of Shenzhen Semiconductor Packaging Technology Fair

https://www.nepconasia.com/en-gb.html

Venue Map and Hotels Around

Shenzhen - Shenzhen World Exhibition & Convention Center, Guangdong, China