Micro Processing Expo 2027

Name: Micro Processing Expo
Start: 2027-02-17
End: 2027-02-19
Location: Koto - Tokyo Big Sight, Tokyo, Japan

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From February 17, 2027 until February 19, 2027

At Koto - Tokyo Big Sight, Tokyo, Japan ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://www.nepconjapan.jp/tokyo/en-gb.html

Categories: Food Industry

Tags: Manufacturing, Packaging, Electronics, conference, exhibition

NEPCON JAPAN is Asia’s premier exhibition for electronics R&D, manufacturing and packaging, scheduled for 17‑19 February 2027 at Tokyo Big Sight. The show aggregates eight specialised expos under one umbrella, covering the full electronics value chain: Power Device & Module Expo, IC & Sensor Packaging Expo, Printed Wiring Board (PWB) Expo, Electronic Components & Materials Expo, Fine Process Technology Expo, EMS & ODM Expo, Electrotest Japan, and InterNEPCON Japan. In addition to the exhibition floor, a technical conference featuring industry‑leading experts will run alongside. Organisers forecast about 1,800 exhibitors and 88,000 visitors, highlighting the event’s role as a one‑stop venue for manufacturers, designers, and suppliers across the electronics sector.

Micro Processing Expo 2027

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