International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2026
InterPACK 2026, held October 26‑29 in San Diego, is the premier ASME conference on electronic and photonic packaging. The exhibition showcases cutting‑edge technologies across several key categories: heterogeneous integration, data‑center and modular edge systems, information storage, extreme‑environment packaging, power/RF electronics and photonics, nanoscale heat transfer and energy storage, additive/printed and flexible/wearable electronics, intelligent modeling and automation, and micro/nano mechatronics and microelectrochemical systems. Topics also cover servers of the future, cloud/edge computing, IoT, autonomous and electric vehicles, and advanced materials. The event combines technical paper sessions, panels, workshops, tutorials, keynotes, and a joint industry‑academic poster session, fostering collaboration among industry leaders, academia, national labs, and start‑ups.
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Venue Map and Hotels Around
San Diego - DoubleTree by Hilton San Diego - Mission Valley, California, USA