DesignCon 2027 | February 2–4 | Santa Clara, CA | Premier Engineering & Design Conference 2027
DesignCon Overview
DesignCon is the premier high-speed communications and system design conference and exposition for chip, board, and systems design engineers. It offers industry-critical engineering education and showcases the latest tools, trends, and technologies in the heart of Silicon Valley.
Conference Program
The expertly curated 15-track conference features technical paper sessions, tutorials, and industry panels covering all aspects of electronic design. Key topics include:
- Signal and power integrity
- High-speed link design
- Machine learning applications
- Chip, board, and systems design
Expo Highlights
The expo hall hosts hundreds of new products and technologies, providing interactive demos and networking opportunities with top suppliers. Key features include:
- Chiphead Theater educational sessions
- Keynote presentations by industry visionaries
- Live product demonstrations
Awards
DesignCon recognizes excellence through several awards, most notably the Engineer of the Year Award, which honors leadership and creativity in the design and test of chips, boards, or systems, with a focus on signal and power integrity. Additional recognitions include Best Paper Awards and the 40 Under 40 program.
Register for entry or booths
Venue Map and Hotels Around
Santa Clara - Santa Clara Convention Center, California, USA