China International Packaging Products & Materials Expo(CIPPME) 2027

PACK FAIR 2027 — Shanghai International Packaging Exhibition

The 18th edition of PACK FAIR is a major trade event covering the entire packaging industry chain. Held at the Shanghai World Expo Exhibition Hall, it features 650+ exhibitors and expects 60,000+ visitors including brand manufacturers, OEM/ODM/OBM factories, agents, wholesalers, and retailers.

Four Co-Located Themed Zones

• PRINT TECH — International Printing Technology Exhibition, one of China's most influential printing trade shows, now in its 19th edition.
• LABEL EXPO — Asia-Pacific focused international label printing exhibition covering labels, processing, and related technologies.
• CIPPME — Packaging Products & Materials Exhibition, a leading trade platform targeting Asian and emerging markets (Southeast Asia, South America, Middle East, North Africa).
• INTPAK — Smart Packaging Industry Exhibition, focusing on packaging technology, machinery, and intelligent packaging solutions.

Key Exhibits & Categories

Category	Highlights
Packaging Products	Various packaging products and materials
Packaging Machinery	Automated packaging equipment, silk-screen printing machines
Printing Technology	Inks, thermal transfer ribbons, printing equipment
Smart Packaging	Intelligent packaging solutions and innovations
Eco Packaging	Green, recyclable, and sustainable packaging materials
Logistics Packaging	Express delivery and logistics packaging solutions

Featured Exhibitors

Notable companies include Haoneng (packaging), Gangyi Screen Printing, Nanjing Aibao (thermal transfer ribbons), Hebei Fangda (logistics packaging), Zhejiang GCL (EPE foam), Dehui Precision Machinery, Ruiqi'er, and Suzhou Kede Education (offset printing inks).

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Register for entry or booths

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Venue Map and Hotels Around

Shanghai - Shanghai World Expo Exhibition and Convention Center, Shanghai, China