China International Packaging Products & Materials Expo (CIPPME) 2027
From
June 02, 2027
until
June 04, 2027
021-64880733
(Please double-check the dates and location on the organizer below before attending.)
Categories: Packaging Industry, Industrial Manufacturing
About China International Packaging Products & Materials Expo (CIPPME)
China International Packaging Products & Materials Expo (CIPPME / PACK FAIR 2027), held June 2-4, 2027 at Shanghai World Expo Exhibition & Convention Center, showcases packaging products, packaging materials, printing technology, green packaging solutions, and sustainable packaging innovations. PACK FAIR connects packaging material suppliers, printing companies, F&B brands, e-commerce platforms, and logistics firms.
What to Expect
- Latest product innovations and cutting-edge technologies
- Business matchmaking and professional networking sessions
- Industry seminars, conferences, and technical workshops
Venue & Schedule
Held at Shanghai World Expo Exhibition & Convention Center, Shanghai, this exhibition provides a comprehensive platform for exploring new business opportunities.
Official Information
For more details, visit the official website.
Register for entry or booths
Please register at the organizer website of China International Packaging Products & Materials Expo (CIPPME)
Venue Map and Hotels Around
Shanghai - Shanghai World Expo Exhibition & Convention Center, Shanghai, China