PACK FAIR – 2026 Shanghai International Packaging Exhibition 2027

Name: PACK FAIR – 2026 Shanghai International Packaging Exhibition
Start: 2027-05-06
End: 2027-05-08
Location: Shanghai - Shanghai World Expo Exhibition & Convention Center, Shanghai, China

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From May 06, 2027 until May 08, 2027

At Shanghai - Shanghai World Expo Exhibition & Convention Center, Shanghai, China ( Show Map)

(Please double-check the dates and location on the organizer below before attending.)

https://interpackexpo.com/

Categories: Packaging Industry, Miscellaneous

Tags: Printing, Packaging, Machinery, Materials, Eco-friendly, smart, exhibition, innovation, trade, Labels

PACK FAIR 2027 — the Shanghai International Packaging Exhibition — will be held from May 6 to 8, 2027 at the Shanghai World Expo Exhibition & Convention Center (SWEECC), 850 Bocheng Road, Pudong, Shanghai, China. Organized by Shanghai Hexin Exhibition Service Co., PACK FAIR is a professional trade show focused on the full packaging industry chain, covering packaging products, materials and related packaging machinery and equipment. The 2027 edition brings together 650 plus packaging brands and over 60,000 buyers from consumer goods, industrial manufacturing, processing, OEM/ODM and distribution channels. The 2026 edition was successfully concluded on June 2 to 4, 2026.

Register for entry or booths

Please register at the organizer website of PACK FAIR – 2026 Shanghai International Packaging Exhibition

https://interpackexpo.com/

Venue Map and Hotels Around

Shanghai - Shanghai World Expo Exhibition & Convention Center, Shanghai, China