IMAPS Nordic - NordPac 2027
NordPac is the annual IMAPS Nordic Microelectronics Packaging Conference and Exhibition, the 63rd event organised by the IMAPS Nordic chapter. The 2027 edition takes place at Quality Hotel Tønsberg in Tønsberg, Norway, from 8 to 10 June 2027. The programme brings together academics and industry leaders to discuss and debate state-of-the-art and future trends in microelectronics and packaging technology, including microelectronics packaging, system integration, reliability testing, PCB design, electronics assembly and manufacturing, electronics in optics, electronics in health technology, advanced materials, artificial intelligence and the Internet of Things in electronics. Alongside the technical programme, NordPac runs a commercial exhibition with exhibitors, short courses and workshops, offering participants a chance to expand their packaging knowledge, meet suppliers and network with peers. Registration is handled through the conference's Conftool portal, with early-bird and standard conference tickets as well as day passes and workshop speaker places available. Papers are submitted as abstracts first and full papers afterwards, and reviewed proceedings are published through IEEE Xplore. NordPac 2026 was held at Kista Science Tower in Stockholm, Sweden, on 9-11 June 2026.
Register for entry or booths
Venue Map and Hotels Around
Tønsberg - Quality Hotel Tønsberg, Vestfold