Microelectronics Show 2027
Microelectronics Show is the advanced electronics packaging exhibition organised by the Japan Institute of Electronics Packaging (JIEP), held concurrently with the JPCA Show. The 2027 edition takes place 2-4 June 2027 (10:00-17:00 JST) in the East Exhibition Halls at Tokyo Big Sight, Tokyo, Japan.
Exhibits cover products, knowledge and solutions for electronic circuits and packaging technology: high-density and high-frequency mounting technology products, high-density substrates and interposers, component-embedded boards, semiconductor chips, System-in-Package (SiP) and System-on-Chip (SoC), display and optical devices and sensors. Materials on show include packaging and thermal-management materials, lead-free solder and joining materials, sealing resins, adhesives and underfill materials, together with high-frequency compatible polymers.
Production and manufacturing technology is a major focus: wire bonders, die bonders, LCD and COG bonders, dispenser machines, flip-chip (FC) mounting, BGA/CSP assembly, TAB placement, OLB/ILB system assembly, COB system assembly, inspection and metrology equipment, and process chemicals.
Concurrent programmes include the Cutting-edge Packaging Technology Symposium, the Academic Plaza for university and research-institute results, and the small-scale eX-tech exhibition. The 2026 edition at Tokyo Big Sight drew 49,206 visitors over three days from 10 to 12 June 2026.
Register for entry or booths
Venue Map and Hotels Around
Tokyo - Tokyo Big Sight (East Exhibition Halls), Tokyo, Japan